Contact Finish - Mating :
115 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post
268-5401-52-1102JH
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RFQ
68,120
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) Beryllium Copper
268-5401-50-1102JH
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RFQ
58,160
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) Beryllium Copper
268-5401-11-1102JH
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RFQ
24,900
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) Beryllium Copper
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RFQ
18,120
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3M CONN SOCKET PQFP 100POS TIN-LEAD OEM Obsolete Bulk 0°C ~ 105°C Through Hole Solder Open Frame QFP Polyethersulfone (PES), Glass Filled - Tin-Lead 200.0µin (5.08µm) 100 (4 x 25) Beryllium Copper - Beryllium Copper
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RFQ
43,220
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3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper
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RFQ
16,120
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3M CONN IC DIP SOCKET ZIF 20POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Beryllium Copper
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Per Unit
$19.83
RFQ
25,340
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3M CONN ZIG-ZAG 39POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Zig-Zag Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 39 (1 x 19, 1 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper
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Per Unit
$19.62
RFQ
52,780
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3M CONN ZIG-ZAG 39POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Zig-Zag Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 39 (1 x 19, 1 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper
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RFQ
21,460
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3M CONN IC DIP SOCKET 28POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
43,600
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
47,460
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
32,780
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3M CONN IC DIP SOCKET 48POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
44,140
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3M CONN IC DIP SOCKET 42POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
58,660
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3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass
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Per Unit
$36.89
RFQ
61,580
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3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper 0.050" (1.27mm) Beryllium Copper
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Per Unit
$36.57
RFQ
31,880
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3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper 0.050" (1.27mm) Beryllium Copper
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RFQ
59,880
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3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
43,660
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3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
68,800
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3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
31,700
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3M CONN IC DIP SOCKET 28POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
60,580
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3M CONN IC DIP SOCKET 28POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
41,080
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
39,700
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
68,620
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3M CONN IC DIP SOCKET 22POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
60,380
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3M CONN IC DIP SOCKET 20POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
45,620
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3M CONN IC DIP SOCKET 20POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
57,060
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
43,560
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
28,920
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3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
19,180
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3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass
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