7 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
43,660
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
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RFQ
68,800
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
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Per Unit
$17.59
RFQ
48,440
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$17.59
RFQ
38,940
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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RFQ
35,540
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
41,740
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
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Per Unit
$5.87
RFQ
19,880
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 32POS GLD OEM Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 32 (2 x 16) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
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