13 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
37,940
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Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
69,840
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Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
28,980
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Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
24,840
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Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
41,380
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Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
27,640
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Amphenol FCI CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
18,300
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Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
50,000
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Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
DILB32P-223TLF
Per Unit
$0.24
RFQ
61,400
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 32POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Copper Alloy 100.0µin (2.54µm) Copper Alloy
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Per Unit
$0.14
RFQ
24,320
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 42POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 42 (2 x 21) Copper Alloy 100.0µin (2.54µm) Copper Alloy
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Per Unit
$0.22
RFQ
61,660
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 24POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 24 (2 x 12) Copper Alloy 100.0µin (2.54µm) Copper Alloy
DILB40P-223TLF
Per Unit
$0.30
RFQ
46,900
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 40POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 40 (2 x 20) Copper Alloy 100.0µin (2.54µm) Copper Alloy
DILB28P-223TLF
Per Unit
$0.21
RFQ
69,800
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Copper Alloy 100.0µin (2.54µm) Copper Alloy
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