4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$1.35
RFQ
67,540
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.74
RFQ
65,020
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 30.0µin (0.76µm) Brass
Default Photo
Per Unit
$1.01
RFQ
54,640
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 18POS TIN iCF Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$1.29
RFQ
49,000
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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