Sockets for ICs, Transistors - EGchip

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6 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	24-4508-31	Per Unit $8.52		PDF RFQ	77,140 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	24 (2 x 12)	Beryllium Copper	10.0µin (0.25µm)	Brass
	24-4508-21	Per Unit $8.52		PDF RFQ	58,520 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	24 (2 x 12)	Beryllium Copper	10.0µin (0.25µm)	Brass
	20-4508-31	Per Unit $8.26		PDF RFQ	65,520 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	10.0µin (0.25µm)	Brass
	20-4508-21	Per Unit $8.26		PDF RFQ	45,360 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-4508-31	Per Unit $7.89		PDF RFQ	25,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-4508-21	Per Unit $7.89		PDF RFQ	51,080 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass

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Semi & E-assets with higher price!

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Electronic Components Recycling