Contact Finish - Post :
Contact Material - Post :
777 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$19.83
RFQ
73,020
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Mill-Max Manufacturing Corp. CONN SOCKET PGA 132POS GOLD 522 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 132 (14 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$17.20
RFQ
43,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$17.20
RFQ
14,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$14.65
RFQ
34,320
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN SOCKET PGA 68POS GOLD 522 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (11 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$14.52
RFQ
42,080
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$14.44
RFQ
63,800
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 225 (18 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.71
RFQ
29,120
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$12.71
RFQ
38,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$11.40
RFQ
27,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
39,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
20,800
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
42,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
76,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
16,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.38
RFQ
28,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$18.35
RFQ
14,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$18.35
RFQ
70,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.32
RFQ
28,060
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$21.65
RFQ
42,340
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$21.65
RFQ
70,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.19
RFQ
75,380
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$11.00
RFQ
38,780
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 52 (2 x 26) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$16.13
RFQ
58,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$16.07
RFQ
36,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$16.02
RFQ
64,360
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$16.02
RFQ
77,340
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$10.11
RFQ
37,040
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 321 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (1 x 64) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$10.05
RFQ
36,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$10.05
RFQ
64,000
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$18.11
RFQ
66,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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