16 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$6.63
RFQ
40,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.63
RFQ
74,080
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.63
RFQ
64,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.63
RFQ
25,040
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.83
RFQ
26,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.82
RFQ
47,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.82
RFQ
13,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
16-C280-10
Per Unit
$2.40
RFQ
79,220
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.77
RFQ
51,640
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.76
RFQ
34,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.86
RFQ
50,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.03
RFQ
71,900
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.03
RFQ
62,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.03
RFQ
34,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.03
RFQ
41,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.33
RFQ
17,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
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