Sockets for ICs, Transistors - EGchip

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4 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
	16-3501-31	Per Unit $3.52		PDF RFQ	69,400 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze
	16-3501-21	Per Unit $3.52		PDF RFQ	46,360 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze
	16-3501-30	Per Unit $2.53		PDF RFQ	76,580 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze
	16-3501-20	Per Unit $2.53		PDF RFQ	60,520 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	501	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze

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Semi & E-assets with higher price!

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Electronic Components Recycling