14 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$1.35
RFQ
67,540
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.75
RFQ
68,100
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
Default Photo
Per Unit
$3.76
RFQ
51,900
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (2 x 9) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
714-43-218-31-018000
Per Unit
$2.83
RFQ
38,280
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
Default Photo
Per Unit
$1.74
RFQ
65,020
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 30.0µin (0.76µm) Brass
Default Photo
Per Unit
$1.07
RFQ
51,220
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$1.06
RFQ
38,540
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
Default Photo
Per Unit
$0.56
RFQ
79,760
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
612-87-318-41-001101
Per Unit
$0.45
RFQ
44,160
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
Default Photo
Per Unit
$0.44
RFQ
65,760
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
Default Photo
Per Unit
$4.09
RFQ
47,720
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (2 x 9) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$1.29
RFQ
49,000
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 18POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper - Brass
612-83-318-41-001101
Per Unit
$0.67
RFQ
57,040
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
Default Photo
Per Unit
$0.65
RFQ
12,900
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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