4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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RFQ
36,040
One step to sell excess stocks.Or submit Qty to get quotes
Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (1 x 32) Beryllium Copper Brass
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RFQ
38,480
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper Beryllium Copper
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RFQ
71,240
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TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper Brass
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RFQ
35,740
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper Brass
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