8 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
65,220
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC SOCKET 20POS XR2 Obsolete Bulk -55°C ~ 125°C - Solder Closed Frame Housing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) - - - 20 (1 x 20) Beryllium Copper - Beryllium Copper
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RFQ
39,600
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 20 (1 x 20) Beryllium Copper 29.5µin (0.75µm) Brass
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Per Unit
$3.29
RFQ
31,760
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$2.15
RFQ
23,520
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$1.48
RFQ
60,520
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$1.75
RFQ
31,720
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$0.97
RFQ
77,000
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$1.31
RFQ
69,540
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
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