4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$0.28
RFQ
65,080
One step to sell excess stocks.Or submit Qty to get quotes
Harwin Inc. CONN SOCKET SIP 15POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 15 (1 x 15) Beryllium Copper 196.9µin (5.00µm) Brass
714-43-115-31-018000
Per Unit
$2.60
RFQ
38,600
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN SOCKET SIP 15POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 15 (1 x 15) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
Default Photo
Per Unit
$0.90
RFQ
71,680
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$0.97
RFQ
19,500
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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