- Part Status :
- Contact Material - Post :
12 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GET PRICE |
76,740
One step to sell excess stocks.Or submit Qty to get quotes
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Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||
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57,400
One step to sell excess stocks.Or submit Qty to get quotes
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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26,680
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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16,020
One step to sell excess stocks.Or submit Qty to get quotes
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Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | ICA | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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34,260
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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43,300
One step to sell excess stocks.Or submit Qty to get quotes
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Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | ICA | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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21,360
One step to sell excess stocks.Or submit Qty to get quotes
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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56,920
One step to sell excess stocks.Or submit Qty to get quotes
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Omron Electronics Inc-EMC Div | CONN ZIG-ZAG 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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52,660
One step to sell excess stocks.Or submit Qty to get quotes
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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48,040
One step to sell excess stocks.Or submit Qty to get quotes
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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17,180
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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63,800
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy |
