- Features :
- Housing Material :
- Number of Positions or Pins (Grid) :
3 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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73,800
One step to sell excess stocks.Or submit Qty to get quotes
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 32 (2 x 16) | Beryllium Copper | Beryllium Copper | |||
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38,540
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | Beryllium Copper | |||
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32,460
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | Brass, Copper |
