Contact Finish Thickness - Mating :
Number of Positions or Pins (Grid) :
4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
Default Photo
Per Unit
$2.85
RFQ
39,220
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper Brass
Default Photo
Per Unit
$2.85
RFQ
47,100
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 24 (2 x 12) Beryllium Copper Brass
Default Photo
Per Unit
$2.82
RFQ
31,020
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash 24 (2 x 12) Beryllium Copper Brass
Default Photo
Per Unit
$2.08
RFQ
56,280
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 22POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 22 (2 x 11) Beryllium Copper Brass
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