5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
BU280Z-178-HT
Per Unit
$1.44
RFQ
58,400
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 28POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 28 (2 x 14) Beryllium Copper Flash Brass
BU480Z-178-HT
Per Unit
$3.48
RFQ
18,500
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 48POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 48 (2 x 24) Beryllium Copper Flash Brass
BU400Z-178-HT
Per Unit
$3.49
RFQ
24,940
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 40POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 40 (2 x 20) Beryllium Copper Flash Brass
BU240Z-178-HT
Per Unit
$1.48
RFQ
69,360
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 24POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 24 (2 x 12) Beryllium Copper Flash Brass
Default Photo
Per Unit
$2.83
RFQ
13,540
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 64POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 64 (2 x 32) Beryllium Copper Flash Brass
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