19 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$2.18
RFQ
19,560
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.69
RFQ
18,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.96
RFQ
48,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.57
RFQ
62,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.57
RFQ
27,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.62
RFQ
51,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.75
RFQ
19,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
32-6518-10
Per Unit
$1.53
RFQ
42,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.64
RFQ
67,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.50
RFQ
17,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.80
RFQ
53,720
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.00
RFQ
33,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.09
RFQ
46,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.10
RFQ
13,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.05
RFQ
29,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.00
RFQ
70,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.96
RFQ
69,000
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.90
RFQ
56,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.99
RFQ
76,220
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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