Sockets for ICs, Transistors - EGchip

Applied Filters :

6 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	34-1518-00	Per Unit $3.30		PDF RFQ	51,940 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 34POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	34 (2 x 17)	Beryllium Copper	200.0µin (5.08µm)	Brass
	34-1518-11	Per Unit $2.31		PDF RFQ	34,960 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 34POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	34 (2 x 17)	Beryllium Copper	10.0µin (0.25µm)	Brass
	34-1518-11H	Per Unit $3.78		PDF RFQ	79,940 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 34POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	34 (2 x 17)	Beryllium Copper	10.0µin (0.25µm)	Brass
	34-1518-10	Per Unit $1.58		PDF RFQ	72,480 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 34POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	34 (2 x 17)	Beryllium Copper	200.0µin (5.08µm)	Brass
	34-1518-10T	Per Unit $1.74		PDF RFQ	13,420 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 34POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	34 (2 x 17)	Beryllium Copper	200.0µin (5.08µm)	Brass
	34-1518-10H	Per Unit $1.90		PDF RFQ	16,460 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 34POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	34 (2 x 17)	Beryllium Copper	200.0µin (5.08µm)	Brass

Page 1 / 1

EGchip's Ambition:

Make the world evergreen by recycling IC Chips,
Semi & E-assets with higher price!

How to Buy

Delivery

Payment Terms

Electronic Components Recycling