73 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
2-382712-1
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RFQ
69,540
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
2-641262-1
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RFQ
75,100
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$4.65
RFQ
22,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
70,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
35,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
25,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
48,540
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
73,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
38,480
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
40,360
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
69,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
74,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
59,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
21,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
58,200
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
35,440
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
26,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
60,560
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
26,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
78,060
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
61,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
29,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
19,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
59,000
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
55,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
71,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
64,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
49,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
40,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
15,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
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