5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$1.42
RFQ
16,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.77
RFQ
53,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.70
RFQ
28,000
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.06
RFQ
12,040
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.20
RFQ
72,720
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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