42 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$6.98
RFQ
29,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.47
RFQ
42,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.64
RFQ
51,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.64
RFQ
14,200
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
40-C182-11
Per Unit
$4.64
RFQ
57,340
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.64
RFQ
62,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.00
RFQ
64,600
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.52
RFQ
77,580
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.48
RFQ
51,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.48
RFQ
43,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.48
RFQ
79,800
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.83
RFQ
26,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.67
RFQ
64,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.77
RFQ
75,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.77
RFQ
46,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.73
RFQ
40,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.52
RFQ
65,480
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.52
RFQ
61,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
40-C212-10
Per Unit
$4.09
RFQ
67,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
28-C182-10
Per Unit
$3.55
RFQ
63,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
40-C182-10
Per Unit
$4.09
RFQ
32,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
16-C280-10
Per Unit
$2.40
RFQ
79,220
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.80
RFQ
77,340
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.56
RFQ
43,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.55
RFQ
33,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.77
RFQ
51,640
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.76
RFQ
70,440
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.76
RFQ
75,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.76
RFQ
34,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.86
RFQ
50,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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