11 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
30,620
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Assmann WSW Components CONN IC DIP SOCKET 22POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
47,460
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 24 (2 x 12) Beryllium Copper Flash Brass
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RFQ
28,820
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 22 (2 x 11) Beryllium Copper - Brass
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RFQ
68,620
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3M CONN IC DIP SOCKET 22POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 22 (2 x 11) Beryllium Copper Flash Brass
110-93-422-41-801000
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RFQ
21,660
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-422-41-801000
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RFQ
55,640
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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RFQ
22,320
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Copper
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RFQ
49,320
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 22 (2 x 11) Beryllium Copper 20.0µin (0.51µm) Copper
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RFQ
24,940
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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RFQ
49,000
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3M CONN IC DIP SOCKET 24POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 24 (2 x 12) Beryllium Copper Flash Brass
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RFQ
69,160
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 22POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 22 (2 x 11) Beryllium Copper Flash Brass
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