13 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
AR18-HZL-TT
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RFQ
77,440
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Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
55,440
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Amphenol FCI CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
57,060
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper Flash Brass
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RFQ
43,560
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper Flash Brass
AR18-HZL/07-TT
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RFQ
47,620
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
33,120
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) 18 (2 x 9) Beryllium Copper 29.5µin (0.75µm) Brass
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RFQ
79,240
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 18 (2 x 9) Beryllium Copper - Copper
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RFQ
46,520
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - 18 (2 x 9) Beryllium Copper - Beryllium Copper
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RFQ
25,120
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Copper
2-641611-1
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RFQ
38,260
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - 18 (2 x 9) Beryllium Copper - Beryllium Copper
4-1571552-5
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RFQ
64,500
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 18 (2 x 9) Beryllium Copper 20.0µin (0.51µm) Copper
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RFQ
74,040
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper Flash Brass
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RFQ
53,040
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 18 (2 x 9) Beryllium Copper Flash Brass
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