19 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
GET PRICE
RFQ
43,220
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 40 (2 x 20) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
AR40-HZL-TT
GET PRICE
RFQ
64,060
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 40POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
40-516-10
GET PRICE
RFQ
68,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
24,840
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
50,000
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
36,320
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 40 (2 x 20) Beryllium Copper - Brass
Default Photo
GET PRICE
RFQ
56,780
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 40 (2 x 20) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
58,660
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
59,880
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper Flash Brass
AR40-HZL/07-TT
GET PRICE
RFQ
36,700
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZL/01-TT
GET PRICE
RFQ
51,900
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-641268-1
GET PRICE
RFQ
36,420
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper - Beryllium Copper
2-641606-2
GET PRICE
RFQ
58,040
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641616-2
GET PRICE
RFQ
67,940
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
57,280
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 40 (2 x 20) Beryllium Copper 29.5µin (0.75µm) Beryllium Copper
1-1825108-3
GET PRICE
RFQ
68,900
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641616-1
GET PRICE
RFQ
79,360
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper - Beryllium Copper
Default Photo
GET PRICE
RFQ
15,700
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
40,460
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 40 (2 x 20) Beryllium Copper Flash Brass
Page 1 / 1