5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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RFQ
24,620
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Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 18 (1 x 18) Beryllium Copper Brass
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RFQ
58,120
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Amphenol FCI CONN SOCKET SIP 18POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (1 x 18) Beryllium Copper Brass
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RFQ
73,060
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Amphenol FCI CONN SOCKET SIP 18POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (1 x 18) Beryllium Copper Brass
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RFQ
76,600
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TE Connectivity AMP Connectors CONN SOCKET SIP 18POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 18 (1 x 18) Beryllium Copper Beryllium Copper
643650-1
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RFQ
42,520
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN SOCKET SIP 18POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 18 (1 x 18) Beryllium Copper Beryllium Copper
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