Sockets for ICs, Transistors - EGchip

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13 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	08-6513-11	Per Unit $0.79		PDF RFQ	41,080 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-6513-10	Per Unit $0.70		PDF RFQ	55,900 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-8937-610C	Per Unit $2.82		PDF RFQ	31,100 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-8750-610C	Per Unit $2.82		PDF RFQ	22,860 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-8415-610C	Per Unit $2.82		PDF RFQ	79,280 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-8400-610C	Per Unit $2.82		PDF RFQ	66,380 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-8240-610C	Per Unit $2.82		PDF RFQ	44,220 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-81000-610C	Per Unit $2.82		PDF RFQ	72,880 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-6513-11H	Per Unit $1.49		PDF RFQ	61,660 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-6513-10H	Per Unit $1.11		PDF RFQ	13,600 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-8305-610C	Per Unit $2.90		PDF RFQ	58,960 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-81250-610C	Per Unit $2.90		PDF RFQ	19,380 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Gold	8 (2 x 4)	Beryllium Copper	10.0µin (0.25µm)	Brass
	08-6513-10T	Per Unit $0.63		PDF RFQ	24,460 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass

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