Contact Finish Thickness - Post :
495 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$13.70
RFQ
56,560
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-382719-1
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RFQ
64,300
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 30POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 30 (2 x 15) Beryllium Copper - Beryllium Copper
2-382714-1
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RFQ
45,580
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper - Beryllium Copper
2-382712-1
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RFQ
69,540
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
Default Photo
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RFQ
29,100
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR64-HZL-TT
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RFQ
31,140
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Assmann WSW Components CONN IC DIP SOCKET 64POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR48-HZL-TT
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RFQ
19,860
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Assmann WSW Components CONN IC DIP SOCKET 48POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZL-TT
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RFQ
64,060
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Assmann WSW Components CONN IC DIP SOCKET 40POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZL-TT
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RFQ
50,820
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Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL-TT
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RFQ
59,340
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Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
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RFQ
30,620
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Assmann WSW Components CONN IC DIP SOCKET 22POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR20-HZL-TT
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RFQ
43,060
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Assmann WSW Components CONN IC DIP SOCKET 20POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR18-HZL-TT
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RFQ
77,440
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Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR16-HZL-TT
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RFQ
71,140
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Assmann WSW Components CONN IC DIP SOCKET 16POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR14-HZL-TT
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RFQ
38,940
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Assmann WSW Components CONN IC DIP SOCKET 14POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZL-TT
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RFQ
62,300
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Assmann WSW Components CONN IC DIP SOCKET 8POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
28-516-10
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RFQ
52,880
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
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RFQ
38,540
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
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RFQ
68,680
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Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$66.07
RFQ
75,680
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$66.07
RFQ
72,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$60.06
RFQ
20,040
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$60.06
RFQ
51,900
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$60.06
RFQ
40,200
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$60.06
RFQ
27,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$57.40
RFQ
63,600
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$57.40
RFQ
47,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$57.40
RFQ
31,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$57.40
RFQ
52,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$26.99
RFQ
77,480
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) - Beryllium Copper 200.0µin (5.08µm) Brass
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