3 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
714-43-230-31-018000
Per Unit
$3.77
RFQ
29,720
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30 (2 x 15) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
117-93-430-41-005000
Per Unit
$2.19
RFQ
25,600
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-430-41-005000
Per Unit
$1.48
RFQ
70,580
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Page 1 / 1