- Manufacture :
- Operating Temperature :
- Housing Material :
- Number of Positions or Pins (Grid) :
- Contact Material - Post :
8 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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39,140
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 10 (1 x 10) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | |||
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16,980
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | 47.2µin (1.20µm) | Copper Alloy | |||
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37,720
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 12POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 12 (1 x 12) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | |||
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53,480
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN SOCKET SOIC ZIF 44POS GOLD | 547 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SOIC, ZIF (ZIP) | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 20.0µin (0.51µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.050" (1.27mm) | 20.0µin (0.51µm) | Beryllium Copper | |||
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68,200
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN SOCKET SOIC ZIF 44POS GOLD | 547 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SOIC, ZIF (ZIP) | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 20.0µin (0.51µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.050" (1.27mm) | 20.0µin (0.51µm) | Beryllium Copper | |||
|
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79,760
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 20 (1 x 20) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | |||
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31,540
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | 47.2µin (1.20µm) | Copper Alloy | |||
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31,660
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 2POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 2 (1 x 2) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper |
