95 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$7.24
RFQ
48,520
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Aries Electronics CONN IC DIP SOCKET 38POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 38 (2 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.78
RFQ
72,540
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 30POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 30 (2 x 15) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.70
RFQ
18,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.67
RFQ
27,020
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.41
RFQ
54,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 34 (2 x 17) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.36
RFQ
24,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.30
RFQ
30,200
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 38POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 38 (2 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.23
RFQ
76,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.22
RFQ
79,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 24POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.53
RFQ
24,640
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 34 (2 x 17) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.30
RFQ
66,900
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 30POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (2 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.20
RFQ
39,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.16
RFQ
34,040
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.49
RFQ
27,920
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
10-3513-10H
Per Unit
$1.48
RFQ
71,600
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.45
RFQ
58,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.38
RFQ
25,600
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.33
RFQ
64,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.67
RFQ
54,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.65
RFQ
54,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.64
RFQ
71,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.82
RFQ
47,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.81
RFQ
78,580
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 4POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 4 (2 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.76
RFQ
66,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.73
RFQ
60,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 12POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.60
RFQ
15,720
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.90
RFQ
48,220
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 38POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 38 (2 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.87
RFQ
62,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.17
RFQ
27,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 2POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.85
RFQ
13,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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