- Part Status :
- Operating Temperature :
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Post :
89 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
43,060
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
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GET PRICE |
77,720
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
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GET PRICE |
51,640
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
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GET PRICE |
45,780
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
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56,980
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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57,960
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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30,440
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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50,960
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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14,940
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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14,320
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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31,000
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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18,780
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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21,620
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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56,640
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 605 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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76,940
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 101 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
49,100
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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58,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 614 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
79,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
22,660
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 111 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
31,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS TINLEAD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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20,080
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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68,240
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
51,140
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
67,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
18,240
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
58,400
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS TINLEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
66,080
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
22,840
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
75,780
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
60,880
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass |
