Contact Finish - Mating :
151 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
110-93-628-41-605000
Per Unit
$6.65
RFQ
48,680
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.62
RFQ
51,480
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.62
RFQ
42,720
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.96
RFQ
34,140
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$4.47
RFQ
79,400
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.39
RFQ
32,560
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.39
RFQ
23,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.67
RFQ
45,540
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-428-41-001000
Per Unit
$7.05
RFQ
59,640
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$3.31
RFQ
77,700
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$3.21
RFQ
15,240
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.21
RFQ
23,440
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.15
RFQ
59,760
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICO Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
Default Photo
Per Unit
$3.13
RFQ
71,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.51
RFQ
51,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
110-93-428-41-001000
Per Unit
$6.74
RFQ
59,700
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.31
RFQ
69,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.22
RFQ
51,320
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 28 (2 x 14) Beryllium Copper 25.0µin (0.63µm) Copper
Default Photo
Per Unit
$2.22
RFQ
64,120
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.22
RFQ
74,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.17
RFQ
65,280
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$6.54
RFQ
13,480
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-43-428-41-005000
Per Unit
$1.46
RFQ
66,380
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$1.45
RFQ
68,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
117-43-628-41-005000
Per Unit
$1.39
RFQ
60,300
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$1.32
RFQ
56,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
110-91-428-41-001000
Per Unit
$6.34
RFQ
22,300
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-328-41-001000
Per Unit
$6.34
RFQ
26,860
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-83-628-41-005101
Per Unit
$0.84
RFQ
24,780
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.070" (1.78mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
117-83-428-41-005101
Per Unit
$0.84
RFQ
51,080
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.070" (1.78mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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