10 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$0.17
RFQ
79,560
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.17
RFQ
59,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.16
RFQ
14,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.14
RFQ
56,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.12
RFQ
74,360
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.12
RFQ
44,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.10
RFQ
22,600
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.10
RFQ
77,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.10
RFQ
49,660
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.10
RFQ
75,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
Page 1 / 1