Number of Positions or Pins (Grid) :
1422 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$13.70
RFQ
65,040
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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RFQ
29,440
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 4POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon, Glass Filled - Gold - Tin 4 (Round) Beryllium Copper - - Brass
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RFQ
39,540
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper - 50.0µin (1.27µm) Beryllium Copper
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RFQ
39,980
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper - 50.0µin (1.27µm) Beryllium Copper
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RFQ
35,320
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Phenolic - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper - 50.0µin (1.27µm) Beryllium Copper
Default Photo
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RFQ
40,340
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Phenolic - Gold - Gold 3 (Oval) Beryllium Copper - - Beryllium Copper
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RFQ
60,860
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Obsolete - - Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
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RFQ
30,600
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Gold 3 (Oval) Beryllium Copper - - Beryllium Copper
Default Photo
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RFQ
37,640
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Gold 3 (Round) Beryllium Copper - - Brass
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RFQ
55,000
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 10POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Tin-Lead 10 (Round) Beryllium Copper - - Brass
Default Photo
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RFQ
30,940
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
71,460
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
14,560
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
63,700
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
37,800
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
21,200
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
78,680
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
66,340
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Grayhill Inc. CONN SOCKET TRANSIST 3POS GOLD 22 Obsolete Bulk - Through Hole Solder Closed Frame Transistor Thermoplastic, Glass Filled - Gold - Gold 3 (Round) Beryllium Copper - - Beryllium Copper
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RFQ
69,160
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Grayhill Inc. CONN SOCKET TRANSIST 3POS GOLD 22 Obsolete Bulk - Through Hole Solder Closed Frame Transistor Thermoplastic, Glass Filled - Gold - Gold 3 (Round) Beryllium Copper - - Beryllium Copper
268-5401-52-1102JH
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RFQ
68,120
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
268-5401-50-1102JH
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RFQ
58,160
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
268-5401-11-1102JH
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RFQ
24,900
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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RFQ
43,220
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3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) Gold 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 250.0µin (6.35µm) Beryllium Copper
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RFQ
16,120
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3M CONN IC DIP SOCKET ZIF 20POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) Gold 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) 250.0µin (6.35µm) Beryllium Copper
2-640361-4
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RFQ
65,700
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 15.0µin (0.38µm) Beryllium Copper
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Per Unit
$95.29
RFQ
42,660
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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Per Unit
$89.27
RFQ
29,080
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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Per Unit
$89.27
RFQ
27,000
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$88.91
RFQ
49,340
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Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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Per Unit
$81.82
RFQ
66,900
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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