Sockets for ICs, Transistors - EGchip

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14 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	32-6823-90C	Per Unit $6.48		PDF RFQ	12,220 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-6822-90C	Per Unit $6.48		PDF RFQ	42,560 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-6820-90C	Per Unit $6.48		PDF RFQ	21,200 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-C212-10H	Per Unit $4.47		PDF RFQ	42,820 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-823-90C	Per Unit $6.49		PDF RFQ	58,840 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-822-90C	Per Unit $6.49		PDF RFQ	47,380 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-C300-00	Per Unit $5.89		PDF RFQ	76,820 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Surface Mount	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-C212-00	Per Unit $5.89		PDF RFQ	22,620 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Surface Mount	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-C182-00	Per Unit $5.89		PDF RFQ	39,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Surface Mount	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	232-1297-00-3303	Per Unit $5.87		PDF RFQ	19,880 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET ZIF 32POS GLD	OEM	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyether Imide (PEI), Glass Filled	0.100" (2.54mm)	Gold	250.0µin (6.35µm)	Gold	32 (2 x 16)	Beryllium Copper	250.0µin (6.35µm)	Beryllium Copper
	32-820-90C	Per Unit $5.84		PDF RFQ	77,800 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Vertisockets™ 800	Active	Bulk	-55°C ~ 105°C	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-C182-10	Per Unit $3.64		PDF RFQ	79,940 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-C300-10	Per Unit $3.08		PDF RFQ	62,620 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-C212-10	Per Unit $3.08		PDF RFQ	54,820 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	EJECT-A-DIP™	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass

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