Sockets for ICs, Transistors - EGchip

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9 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
	24-3554-11	Per Unit $6.65		PDF RFQ	23,980 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	24-6553-11	Per Unit $6.65		PDF RFQ	35,060 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	28-3554-11	Per Unit $7.66		PDF RFQ	45,580 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	24-6552-11	Per Unit $6.03		PDF RFQ	76,320 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	24-6551-11	Per Unit $6.03		PDF RFQ	28,660 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	24-3553-11	Per Unit $6.03		PDF RFQ	57,040 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	24-3552-11	Per Unit $6.03		PDF RFQ	27,320 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	24-3551-11	Per Unit $6.03		PDF RFQ	42,160 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper
	24-6554-11	Per Unit $7.07		PDF RFQ	41,800 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	24 (2 x 12)	Beryllium Copper

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Electronic Components Recycling