- Part Status :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Post :
25 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
57,060
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||
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15,240
One step to sell excess stocks.Or submit Qty to get quotes
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS TINLEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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40,440
One step to sell excess stocks.Or submit Qty to get quotes
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Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
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64,600
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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16,460
One step to sell excess stocks.Or submit Qty to get quotes
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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40,480
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
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75,780
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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46,160
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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16,380
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
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39,740
One step to sell excess stocks.Or submit Qty to get quotes
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Mill-Max Manufacturing Corp. | CONN ZIG-ZAG 28POS GOLD | 410 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, Right Stackable | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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44,340
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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30,380
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Nickel | |||
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54,340
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 5.00µin (0.127µm) | Brass, Copper | |||
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49,940
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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62,500
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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20,260
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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47,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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16,480
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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75,640
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS TINLEAD | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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13,520
One step to sell excess stocks.Or submit Qty to get quotes
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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31,960
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 28 (2 x 14) | Beryllium Copper | 25.0µin (0.63µm) | Nickel | |||
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13,320
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
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23,060
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 28 (2 x 14) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
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49,520
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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21,260
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |
