Contact Finish - Post :
Contact Finish Thickness - Post :
485 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$13.70
RFQ
65,040
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
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RFQ
30,940
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
71,460
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
14,560
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
63,700
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
37,800
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
21,200
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
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RFQ
78,680
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
28-516-10
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RFQ
52,880
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
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RFQ
38,540
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
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RFQ
68,680
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Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$88.91
RFQ
49,340
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$81.82
RFQ
66,900
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$78.54
RFQ
56,720
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$78.24
RFQ
30,820
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$76.36
RFQ
25,900
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$75.83
RFQ
38,540
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$75.23
RFQ
41,460
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$72.22
RFQ
49,720
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 480 (29 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$68.61
RFQ
41,580
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 456 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$66.07
RFQ
12,660
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$66.07
RFQ
28,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$65.00
RFQ
24,620
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 432 (31 x 31) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$64.61
RFQ
22,500
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$63.19
RFQ
75,260
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 420 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$60.19
RFQ
27,420
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 400 (20 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$59.46
RFQ
24,840
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$58.38
RFQ
16,980
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 388 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$57.08
RFQ
26,860
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$55.49
RFQ
19,500
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 10.0µin (0.25µm) Brass
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