- Manufacture :
- Part Status :
- Pitch - Mating :
- Number of Positions or Pins (Grid) :
4 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GET PRICE |
29,440
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 4POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Tin | 4 (Round) | Beryllium Copper | - | Brass | ||
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41,520
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 8POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Gold | 8 (Round) | Beryllium Copper | - | Brass | |||
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52,840
One step to sell excess stocks.Or submit Qty to get quotes
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 4POS | 8059 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Gold | 4 (Round) | Beryllium Copper | - | Brass | |||
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74,180
One step to sell excess stocks.Or submit Qty to get quotes
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Harwin Inc. | CONN IC DIP SOCKET 99POS GOLD | D2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA), Nylon, Glass Filled | 0.200" (5.08mm) | Gold | Flash | Tin | 99 (1 x 99) | Beryllium Copper | 196.9µin (5.00µm) | Brass |
