Sockets for ICs, Transistors - EGchip

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12 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
	40-6552-16	Per Unit $20.48		PDF RFQ	65,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-6551-16	Per Unit $20.48		PDF RFQ	67,080 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	36-6553-18	Per Unit $37.09		PDF RFQ	32,240 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-6554-16	Per Unit $22.49		PDF RFQ	30,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-6553-11	Per Unit $8.05		PDF RFQ	18,120 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-6552-11	Per Unit $8.05		PDF RFQ	51,980 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	40 (2 x 20)	Beryllium Copper
	40-6551-11	Per Unit $8.05		PDF RFQ	60,680 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	40 (2 x 20)	Beryllium Copper
	40-6554-10	Per Unit $7.29		PDF RFQ	21,760 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-6553-10	Per Unit $6.05		PDF RFQ	44,740 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	40 (2 x 20)	Beryllium Copper
	40-6552-10	Per Unit $6.05		PDF RFQ	44,860 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-6551-10	Per Unit $6.05		PDF RFQ	43,640 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	40 (2 x 20)	Beryllium Copper
	40-6554-11	Per Unit $8.94		PDF RFQ	36,080 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD	55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	40 (2 x 20)	Beryllium Copper

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Electronic Components Recycling