Sockets for ICs, Transistors - EGchip

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8 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
	40-6552-16	Per Unit $20.48		PDF RFQ	65,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-6551-16	Per Unit $20.48		PDF RFQ	67,080 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-3553-16	Per Unit $20.48		PDF RFQ	56,620 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-3552-16	Per Unit $20.48		PDF RFQ	76,940 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-3551-16	Per Unit $20.48		PDF RFQ	57,480 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-3554-16	Per Unit $22.49		PDF RFQ	22,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-6554-16	Per Unit $22.49		PDF RFQ	30,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper
	40-6553-11	Per Unit $8.05		PDF RFQ	18,120 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Copper

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Electronic Components Recycling