39 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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14,780
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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74,020
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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79,000
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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17,060
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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34,400
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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65,540
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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61,240
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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17,420
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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67,100
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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17,640
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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47,560
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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21,500
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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27,660
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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45,000
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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13,020
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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78,080
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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59,820
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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38,020
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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67,000
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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60,740
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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26,240
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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17,900
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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41,540
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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69,100
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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51,340
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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25,980
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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54,160
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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68,420
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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15,720
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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79,000
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass |