Contact Finish - Post :
290 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
2-382712-1
GET PRICE
RFQ
69,540
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Beryllium Copper
Default Photo
GET PRICE
RFQ
63,700
One step to sell excess stocks.Or submit Qty to get quotes
Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
GET PRICE
RFQ
76,740
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
GET PRICE
RFQ
72,100
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Phosphor Bronze
AR16-HZL-TT
GET PRICE
RFQ
71,140
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 16POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
31,380
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 16POS TINLEAD DPF3 Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
28,840
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 16POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
62,020
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
21,500
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
GET PRICE
RFQ
64,720
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TINLEAD - Obsolete - - Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 3.00µin (0.076µm) Tin-Lead 16 (2 x 8) Beryllium Copper 5.00µin (0.127µm) Brass
Default Photo
GET PRICE
RFQ
55,760
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD Diplomate DL Obsolete - - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
68,600
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 16 (2 x 8) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
28,920
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 16 (2 x 8) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
19,180
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 16 (2 x 8) Beryllium Copper Flash Brass
1-1825094-4
GET PRICE
RFQ
42,460
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
AR16-HZL/07-TT
GET PRICE
RFQ
45,560
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR16-HZL/01-TT
GET PRICE
RFQ
29,020
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-641600-2
GET PRICE
RFQ
12,940
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641610-1
GET PRICE
RFQ
19,140
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete - - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Beryllium Copper
2-641262-1
GET PRICE
RFQ
75,100
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Beryllium Copper
Default Photo
GET PRICE
RFQ
37,060
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 16 (2 x 8) Beryllium Copper Flash Brass
Default Photo
GET PRICE
RFQ
62,760
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 16POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 16 (2 x 8) Beryllium Copper Flash Brass
Default Photo
Per Unit
$7.20
RFQ
57,400
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 612 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$8.52
RFQ
55,640
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.62
RFQ
36,920
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-316-41-605000
Per Unit
$6.47
RFQ
24,860
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$5.76
RFQ
56,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.95
RFQ
64,460
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$4.38
RFQ
49,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.81
RFQ
64,080
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 16 (2 x 8) Beryllium Copper - Brass
Page 1 / 10