Contact Finish - Mating :
Contact Finish - Post :
Contact Material - Post :
216 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
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RFQ
14,560
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
AR18-HZL-TT
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RFQ
77,440
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Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
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RFQ
55,440
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Amphenol FCI CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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RFQ
17,120
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole, Right Angle, Vertical Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 18 (2 x 9) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
Default Photo
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RFQ
57,060
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 18 (2 x 9) Beryllium Copper Flash Brass
Default Photo
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RFQ
43,560
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 18 (2 x 9) Beryllium Copper Flash Brass
AR18-HZL/07-TT
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RFQ
47,620
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Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
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RFQ
33,120
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 18 (2 x 9) Beryllium Copper 29.5µin (0.75µm) Brass
Default Photo
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RFQ
79,240
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper - Copper
Default Photo
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RFQ
46,520
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - - 18 (2 x 9) Beryllium Copper - Beryllium Copper
Default Photo
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RFQ
25,120
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Copper
2-641611-1
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RFQ
38,260
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper - Beryllium Copper
4-1571552-5
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RFQ
64,500
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 18 (2 x 9) Beryllium Copper 20.0µin (0.51µm) Copper
Default Photo
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RFQ
74,040
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3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 18 (2 x 9) Beryllium Copper Flash Brass
Default Photo
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RFQ
53,040
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 18POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 18 (2 x 9) Beryllium Copper Flash Brass
Default Photo
Per Unit
$7.19
RFQ
26,240
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$8.52
RFQ
60,920
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Aries Electronics CONN IC DIP SOCKET 18POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.44
RFQ
17,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.44
RFQ
63,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.44
RFQ
22,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.69
RFQ
17,240
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.67
RFQ
74,760
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$7.03
RFQ
22,840
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$3.37
RFQ
35,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
110-93-318-41-105000
Per Unit
$6.51
RFQ
70,200
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$2.22
RFQ
35,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
299-87-618-10-002101
Per Unit
$2.18
RFQ
17,180
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
Default Photo
Per Unit
$1.43
RFQ
54,620
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
Default Photo
Per Unit
$1.42
RFQ
28,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (2 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
116-83-318-41-004101
Per Unit
$1.42
RFQ
26,620
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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