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24 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
Default Photo
32-6552-16
Per Unit
$17.34
RFQ
18,740
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6551-16
Per Unit
$17.34
RFQ
14,260
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3553-16
Per Unit
$17.34
RFQ
25,720
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3552-16
Per Unit
$17.34
RFQ
18,020
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3551-16
Per Unit
$17.34
RFQ
59,920
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
28-6553-18
Per Unit
$31.84
RFQ
74,140
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6554-16
Per Unit
$14.58
RFQ
35,760
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3554-11
Per Unit
$7.50
RFQ
66,040
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3554-16
Per Unit
$19.04
RFQ
35,680
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3554-10
Per Unit
$5.65
RFQ
40,680
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6552-11
Per Unit
$6.75
RFQ
54,600
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-6551-11
Per Unit
$6.75
RFQ
57,380
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3553-11
Per Unit
$6.75
RFQ
51,740
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3552-11
Per Unit
$6.75
RFQ
55,040
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3551-11
Per Unit
$6.75
RFQ
58,640
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-6553-11
Per Unit
$6.03
RFQ
55,780
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6553-10
Per Unit
$5.07
RFQ
43,180
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-6552-10
Per Unit
$5.07
RFQ
16,260
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6551-10
Per Unit
$5.07
RFQ
55,320
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3553-10
Per Unit
$5.07
RFQ
27,460
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3552-10
Per Unit
$5.07
RFQ
32,620
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3551-10
Per Unit
$5.07
RFQ
42,340
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
32-6554-11
32-6554-11
Per Unit
$7.50
RFQ
77,120
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
32-6554-10
32-6554-10
Per Unit
$6.11
RFQ
33,080
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
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