4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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RFQ
25,120
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper Copper
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Per Unit
$1.61
RFQ
22,300
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper Beryllium Copper
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Per Unit
$0.94
RFQ
14,380
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 18 (2 x 9) Beryllium Copper Nickel
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Per Unit
$1.06
RFQ
38,540
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 18 (2 x 9) Beryllium Copper Beryllium Copper
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