5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
5-1571551-0
Per Unit
$0.75
RFQ
73,620
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 32 (2 x 16) Beryllium Copper Nickel
Default Photo
Per Unit
$1.84
RFQ
48,940
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 32 (2 x 16) Beryllium Copper Copper
Default Photo
Per Unit
$1.73
RFQ
73,800
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 25.0µin (0.63µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
6-1437532-1
Per Unit
$1.96
RFQ
18,220
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$4.71
RFQ
57,500
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
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