Sockets for ICs, Transistors - EGchip

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14 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	18-3518-10E	Per Unit $3.37		PDF RFQ	35,980 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-101H	Per Unit $2.22		PDF RFQ	35,140 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-11	Per Unit $1.42		PDF RFQ	28,860 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	18 (2 x 9)	Beryllium Copper	10.0µin (0.25µm)	Brass
	18-3518-10T	Per Unit $0.70		PDF RFQ	20,480 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-111	Per Unit $2.65		PDF RFQ	29,240 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	18 (2 x 9)	Beryllium Copper	10.0µin (0.25µm)	Brass
	18-3518-102	Per Unit $2.54		PDF RFQ	29,860 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-112	Per Unit $2.79		PDF RFQ	53,340 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	18 (2 x 9)	Beryllium Copper	10.0µin (0.25µm)	Brass
	18-3518-10H	Per Unit $1.71		PDF RFQ	14,340 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-10	Per Unit $1.09		PDF RFQ	51,760 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-01	Per Unit $3.86		PDF RFQ	34,640 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-11H	Per Unit $3.01		PDF RFQ	63,840 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	18 (2 x 9)	Beryllium Copper	10.0µin (0.25µm)	Brass
	18-3518-101	Per Unit $2.02		PDF RFQ	52,660 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-10M	Per Unit $1.93		PDF RFQ	30,560 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-3518-00	Per Unit $1.23		PDF RFQ	49,780 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (2 x 9)	Beryllium Copper	200.0µin (5.08µm)	Brass

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Electronic Components Recycling