Sockets for ICs, Transistors - EGchip

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14 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	28-3518-11H	Per Unit $4.39		PDF RFQ	32,560 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-3518-111	Per Unit $3.21		PDF RFQ	23,440 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-3518-01	Per Unit $6.31		PDF RFQ	69,840 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-3518-11	Per Unit $2.22		PDF RFQ	64,120 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-3518-112	Per Unit $3.56		PDF RFQ	71,480 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	28 (2 x 14)	Beryllium Copper	10.0µin (0.25µm)	Brass
	28-3518-10TLH	Per Unit $2.49		PDF RFQ	36,540 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-10	Per Unit $1.53		PDF RFQ	52,360 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-102	Per Unit $2.84		PDF RFQ	60,020 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-10H	Per Unit $2.74		PDF RFQ	74,060 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-101	Per Unit $2.73		PDF RFQ	46,220 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-10T	Per Unit $1.00		PDF RFQ	16,800 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-10E	Per Unit $5.09		PDF RFQ	74,120 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-10M	Per Unit $3.05		PDF RFQ	36,420 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass
	28-3518-00	Per Unit $2.11		PDF RFQ	53,960 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)	Brass

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Electronic Components Recycling