29 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$1.45
RFQ
77,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
35,100
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
56,540
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
48,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
21,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
37,800
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
76,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
35,640
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
60,120
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
24,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
72,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
55,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
16,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
25,900
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
58,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
29,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
38,080
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
30,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
43,640
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
35,360
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
57,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.82
RFQ
70,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.87
RFQ
75,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.38
RFQ
43,820
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
210-13-308-41-001000
Per Unit
$6.10
RFQ
25,120
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
08-3518-11
Per Unit
$0.99
RFQ
17,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 8POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
ICA-308-SGT
Per Unit
$0.75
RFQ
39,920
One step to sell excess stocks.Or submit Qty to get quotes
Samtec Inc. CONN IC DIP SOCKET 8POS GOLD ICA Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.62
RFQ
77,120
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
110-13-308-41-001000
Per Unit
$0.59
RFQ
77,660
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Page 1 / 1